Years of
experience
We are the former Rugao Shuguang Tungsten Molybdenum Material Co., Ltd. founded in 1984.There are currently over 120 employees, covering an area of 10 acres. After restructuring, Shuguang has rapidly become a major domestic tungsten and molybdenum production and processing enterprise in recent years, relying on years of production technology and skilled employees from the old factory. Rongxin Electrical Control Technology Co., Ltd. is professional China Tungsten Particles Manufacturers and Custom Tungsten Particles Factory. And the company is mainly engaged in the R & D of electrical control technology, the production of electrical switch contacts, automobile horn contacts, automobile electrical contacts, and the sales of tungsten molybdenum materials and tungsten molybdenum products.
Years of
experience
Number of
employees
Area of
factory
Number of
team talents
Raw materials preparation and mixing
The production process of Nantong Rongxin Tungsten Particles begins with a strict screening of raw materials. The company is committed to selecting high-purity tungsten sources, such as sodium tungstate and ammonium tungstate, to ensure the purity and quality of the raw materials used. After entering the raw material mixing stage, the tungsten source and an appropriate amount of additives are mixed in an exact proportion. The selection of additives and their proportions have a crucial impact on the performance of the final product. For example, a proper amount of surfactant can significantly improve the dispersion of particles and thus enhance the uniformity of the product. Through efficient mixing equipment, ensure that the raw materials are fully mixed evenly, laying a solid foundation for the subsequent preparation process.
Chemical reduction reaction
The evenly mixed raw materials will enter the chemical reduction reaction stage. Nantong Rongxin uses advanced chemical reduction technology to reduce tungsten ions in the tungsten source to metal tungsten under specific temperature, pressure and solution environments. This process requires precise control of the reaction conditions to ensure the particle size, morphology and purity of the tungsten particles. For example, by adjusting the reaction temperature and the pH value of the solution, the growth rate and morphology of the tungsten particles can be effectively controlled, thereby obtaining tungsten particles with specific properties. During the reaction process, the company uses advanced online monitoring equipment to monitor the reaction parameters in real time and adjust the reaction conditions in a timely manner to ensure the stability and consistency of the reaction.
Wash and dry
After the chemical reduction reaction is completed, the obtained tungsten particles need to be washed and dried. The washing process uses deionized water or a specific washing liquid to remove impurities and residual reactants from the surface of the particles. Through multiple washings, the purity of the tungsten particles reaches the predefined standard. In the drying stage, advanced drying equipment, such as vacuum drying chambers or spray dryers, quickly remove moisture from tungsten particles at appropriate temperatures and pressures. The temperature and time are strictly controlled throughout the drying process to avoid the oxidation and aggregation of tungsten particles.
Screening and grading
The dried tungsten particles will enter the screening and grading stage. The company adopts high-precision screening equipment to classify tungsten particles according to different particle size ranges according to customer specific needs. Through screening, tungsten particle products with uniform particle size and narrow distribution can be obtained to meet the application needs of different fields. At the same time, the graded tungsten particles are strictly tested to ensure that the quality and performance of the product meet industry standards.
Post-processing and packaging
In order to further improve the performance and stability of tungsten particles, Nantong Rongxin also post-processes the graded products. Post-treatment processes include surface modification and heat treatment, which can significantly improve the surface performance of tungsten particles and improve their oxidation resistance and corrosion resistance. Post-treated tungsten pellet products will be packaged using professional packaging materials to ensure the safety and stability of the products during transportation and storage.
Short-term storage environment requirements
During short-term storage, Nantong Rongxin recommends placing tungsten particles in a clean, environmentally controlled container. If a non-sealed storage device is used, it is also necessary to ensure the controllability of its storage environment. In case of exposure to clean air only (using uninterrupted laminar flow), the tungsten particles in operation can be temporarily stored in an open container.
In terms of specific environmental conditions, when process operations are not performed, the storage container should be placed in a controlled environment, and the ideal gas environment is dry air or nitrogen. To ensure the stability of the material, it is recommended to keep the tungsten particles in the original packaging or in other devices suitable for storage. At the same time, the use of special storage cabinets is crucial. 99% nitrogen or dry air should be used as purified gas in the cabinet. The temperature should be controlled between 17°C and 28°C. The relative humidity should be maintained between 7% and 30%. The number of suspended particles must comply with the ISO6 level requirements of GB/T 25915.1-2010 standard.
Long-term storage environment requirements
Long-term storage refers to placing tungsten particles in an undisturbed environment for storage for more than 12 months and remain available after storage. During long-term storage, special considerations should be given to chip defects that may result from mechanical damage. When tungsten particles are placed and removed, measures must be taken to avoid damage to the product and ensure adequate protection is provided to prevent the product from being affected by movement or vibration. The placement direction of the wafer or chip is critical in some cases, especially for microelectromechanical systems (MEMS) or sensor products, and damage caused by shock and vibration should be minimized. During the installation of storage containers or shelves, measures to prevent vibration and resonance must be taken, and the design of packaging materials should also have certain anti-impact and anti-vibration functions.
Regarding the environmental requirements for long-term storage, it is recommended to use purified gas with 99% nitrogen or inert gas for storage. The temperature should be kept between 17°C and 25°C, the relative humidity should be controlled between 7% and 25%, and the gas pressure should be higher than the ambient atmospheric pressure. To effectively control relative humidity, high-purity nitrogen is usually used, and the relative humidity should not be less than 7% to prevent static electricity accumulation, and it should not be higher than 25% to avoid condensation and moisture ingress. Detailed records of temperature and humidity beyond the range must be made, and necessary adjustment measures should be taken in the event of overtemperature or excessive humidity.
Inert gas and packaging requirements
The inert gas required in the storage environment should meet the standard of gas purity greater than 99.5%, the content of oxygen and argon should be less than 0.5%, the content of halogenated gas should be less than 1×10⁻⁶, the content of vulcanized gas should also be less than 1×10⁻⁶, and the content of other gases should be less than 0.01%. When choosing packaging materials, the choice of metal foils and other materials should be given priority to avoid the use of degradable materials. Vacuum packaging is usually used when transporting bare chip products, but vacuum packaging is not recommended for long-term storage. Except for closed, nitrogen-filled foam materials, foam materials should not be used inside vacuum packaging. The desiccant in the initial packaging may cause small particles to damage the chip, so positive pressure packaging is more suitable for long-term storage than vacuum packaging.