English
中文简体
Solid molybdenum cutting wire is typically used for the precise and clean cutting of delicate materials, such as silicon wafers used in semiconductor manufacturing. The wire is exceptionally thin and can be as fine as a few micrometers in diameter. It is often used in wire-cut electrical discharge machining (EDM) processes, which are widely used in the semiconductor industry for producing intricate and precise shapes in semiconductor materials. The wire-cut EDM process involves threading a thin molybdenum wire through a workpiece and then energizing the wire with an electrical discharge. As the wire moves through the workpiece, it erodes the material and creates the desired shape with high precision. The process is computer-controlled, allowing for intricate and complex shapes to be cut with ease.
- Electrical Contact
- Tungsten Rod
- Tungsten Needle
- Tungsten Particles
- Tungsten Electrode
- Tungsten Spheres/Tungsten Ball
- Solid Molybdenum Wire
- Special Shaped Molybdenum Electrode
- High Temperature Resistant Special-Shaped Molybdenum Screw
- Rivet
- Single-Phase Motor Centrifugal Switch
- Tungsten Disc/Tungsten Plate
